Peelable Solder Mask – Techspray 2218

Peelable Solder Mask – Techspray 2218

Techspray Wondermask PL 2218 is a temporary Natural Latex peelable solder mask that helps to get rid of complicated temporary Tape Masking of PCB and Electronic Components. Techspray Peelable Wonder Mask 2218 is formulated to withstand fluxing, wave soldering and cleaning operations. This solder mask is designed to be used for masking in conformal coating application processes, robotic, pneumatic, hand applied or template screening (not recommended for silk screening). Mask is Easily Peelable and Quick Drying.

Features & Benefits

  • Fastest Full Cure
  • Non-flammable
  • Non-ozone depleting
  • Easily peelable
  • Highest strength to avoid breakage

How to Use Solder Mask

For best results, apply a 20 to 30 mil coating to desired area. Make sure that the substrate is free from any contamination such as grease, oil, and particulates. Use our PCB cleaning chemicals. Drying time of the solder mask depend on ambient humidity. Make sure not to over cure that could lead to blistering of mask causing removal problems.

  • Make: Techspray, USA
  • Packaging: 8 oz
  • Suitable for Lead-Free

Note:

  1. Download the Datasheet / Brochure and MSDS (Material Safety Datasheet) from the Top Right Corner for details like Features, Specification, Safety Precautions and Application Instructions.
  2. To Know Price / Rate / Quotation and to buy this product, Please use the Online Enquiry Form. Please feel free to write an email to us or call us for any assistance.
Peelable Solder Mask – Techspray 2211

Peelable Solder Mask – Techspray 2211

Techspray Wondermask P 2211 is a temporary synthetic latex peelable solder mask that helps to get rid of complicated temporary Tape Masking of PCB and Electronic Components. Techspray Peelable Wonder Mask 2211 is formulated to withstand fluxing, wave soldering and cleaning operations. This solder mask is designed to be used for masking in conformal coating application processes, robotic, pneumatic, hand applied or template screening (not recommended for silk screening). Mask is Easily Peelable, Quick Drying, Non-Corrosive, Non-Ammoniated.

Features & Benefits

  • Non-ammoniated
  • Non-flammable
  • Non-ozone depleting
  • Easily peelable
  • Low odor
  • Cure indicator : darkens as it cures
  • Compatible with gold and copper leads
  • Non-corrosive

How to Use Solder Mask

For best results, apply a 20 to 30 mil coating to desired area. Make sure that the substrate is free from any contamination such as grease, oil, and particulates. Use our PCB cleaning chemicals. Drying time of the solder mask depend on ambient humidity. Under normal conditions, Techspray WonderMask P 2211 is ready for preheating stage in 1 hour, however, cure can be accelerated to 30 minutes at 65 Degree Celsius / 150 Degree Fahrenheit or 20 minutes at 82°C / 180°F. Make sure not to over cure that could lead to blistering of mask causing removal problems. Mask will change from an opaque pink to a translucent red when curing is done. This temporary peelable solder mask does not have to be completely cured to withstand soldering operation; however, it should be completely translucent before removal.

  • Make: Techspray, USA
  • Packaging: 8 oz
  • Suitable for Lead-Free

Note:

  1. Download the Datasheet / Brochure and MSDS (Material Safety Datasheet) from the Top Right Corner for details like Features, Specification, Safety Precautions and Application Instructions.
  2. To Know Price / Rate / Quotation and to buy this product, Please use the Online Enquiry Form. Please feel free to write an email to us or call us for any assistance.
BGA Reballing Kit – Goot XRB

BGA Reballing Kit – Goot XRB

Goot XRB Reball Kit allows repair and replacement of solder balls on a BGA. XRB Reball Kits are customized for specific BGAs. Please send us the technical drawings of your BGA.

Also required to reball and repair BGA components: Hot-air rework station (XFC-110/XFC-210/XFC-300-301), soldering iron, desoldering wick, cream solder, and solder balls. (Sold separately.)

This BGA Reballing Kit Consists of Following:

  1. Metal Mask
  2. Ball Guide
  3. Guide Plate
  4. Base
  5. Tamper
  6. Spatula
  7. Hose (To Connect the Base with the Vacuum Source)

How to Raball BGA?

  1. Remove the existing solder balls on the BGA chip with a soldering iron and desoldering wick.
  2. Set the Guide Plate on the base, and hold the BGA with the vacuum source.
  3. Set the Metal Mask. Use the spatula to apply the cream solder to all the holes.
  4. Mount the Ball Guide. Pour the solder balls into the holes.
  5. Press the solder balls into the cream solder with the tamper.
  6. Take out the BGA from the base, and apply heat.

Make: Goot, Japan

Note:

  1. Download the Catalog from the Top Right Corner for details like, features, specification etc.
  2. To Know Price / Rate / Quotation and to buy this product, Please use the Online Enquiry Form. Please feel free to write an email to us or call us for any assistance.
SMD / BGA Rework Station – Goot GSR-302

SMD / BGA Rework Station – Goot GSR-302

Goot GSR-302 is best available economical ESD Safe SMD – BGA Rework / Repairing Station / System that can take care of any repairing work of BGA (Ball Grid Array), CSP, QFP and other SMD Components.

This SMD and BGA Rework System is equipped with 5 Zone Temperature Profile. It has separate Digital Display for set and running temperature Value. Nozzle offset Facility for precision in process. System has 20 Profiles storage memory. Bottom heater XPR-1000 for thermal Equilibrium. Tool arm Holder XK-2 Help for easy handling with up and down Motion and PCB Holder can Handel Max 424mm x 460mm to open side any PCB.

The system consists of following:

  1. Preheater – XPR-1000
  2. Hot Air Rework Station – XFC-301
  3. Handpiece Holder – XK-2
  4. PCB Holder – Included with XPR-1000

Make: Goot, Japan

Note: Nozzles are sold separately. Please select nozzles as per your requirement and application.

Note:

  1. Download the Catalog from the Top Right Corner for details like, features, specification, Desoldering Nozzles and Other Replacement Parts.
  2. To Know Price / Rate / Quotation and to buy this product, Please use the Online Enquiry Form. Please feel free to write an email to us or call us for any assistance.
SMD / BGA Rework Station – Goot GSR-210

SMD / BGA Rework Station – Goot GSR-210

Goot GSR-210 is best available economical ESD Safe SMD – BGA Rework / Repairing Station / System that can take care of any repairing work of BGA (Ball Grid Array), CSP, QFP and other SMD Components.

This SMD and BGA Rework System is equipped with 5 Zone Temperature Profile. It has separate Digital Display for set and running temperature Value. Nozzle offset Facility for precision in process. System has 20 Profiles storage memory. Bottom heater XPR-600 for thermal Equilibrium. Tool arm Holder XK-1 Help for easy handling with up and down Motion and PCB Holder XU-1 can Handel Max 305mm to open side any PCB.

The system consists of following:

  1. Preheater – XPR-600
  2. Hot Air Rework Station – XFC-210
  3. Handpiece Holder – XK-2
  4. PCB Holder – XU-1

Make: Goot, Japan

Note: Nozzles are sold separately. Please select nozzles as per your requirement and application.

Note:

  1. Download the Catalog from the Top Right Corner for details like, features, specification, Desoldering Nozzles and Other Replacement Parts.
  2. To Know Price / Rate / Quotation and to buy this product, Please use the Online Enquiry Form. Please feel free to write an email to us or call us for any assistance.