Goot XRB Reball Kit allows repair and replacement of solder balls on a BGA. XRB Reball Kits are customized for specific BGAs. Please send us the technical drawings of your BGA.
This BGA Reballing Kit Consists of Following:
- Metal Mask
- Ball Guide
- Guide Plate
- Hose (To Connect the Base with the Vacuum Source)
How to Raball BGA?
- Remove the existing solder balls on the BGA chip with a soldering iron and desoldering wick.
- Set the Guide Plate on the base, and hold the BGA with the vacuum source.
- Set the Metal Mask. Use the spatula to apply the cream solder to all the holes.
- Mount the Ball Guide. Pour the solder balls into the holes.
- Press the solder balls into the cream solder with the tamper.
- Take out the BGA from the base, and apply heat.
Make: Goot, Japan
- Download the Catalog from the Top Right Corner for details like, features, specification etc.
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